Intel's Long Awaited BTX Form Factor
by Purav Sanghani on November 15, 2004 5:31 AM EST- Posted in
- Cases/Cooling/PSUs
BTX Cooling and Airflow Explained
We know the purpose of the BTX design and why each component is placed where it is, but the question is, will it work? Will a single CPU heatsink fan be able to effectively cool all of the critical components in a system? In our preview of BTX last year we explained the placement of each component as well as showed a top view of the heat paths in a BTX system. The CPU, Northbridge, Southbridge, and VGA card are all inline which creates a single path for air to flow and in one single direction, from front to back through the thermal module.
From the picture we see the flow of air pushed back through the CPU thermal module towards the Northbridge, Southbridge, and VGA card. As this air flows around the CPU, it warms up, as we can see from the red areas to the left and right of the CPU. This warm air then flows over the Northbridge and seems to cool as it travels further back in the chassis. At the left we see the channel of air flowing to the left over the memory and out through the PSU. The channel on the right flows straight back to the VGA card and out through groups of holes in the back of the case.
Intel will incorporate various other features that will help their CPUs perform at an efficient level no matter the conditions beginning with the Pentium 4 6xx series chips scheduled for Q1 of 2005. One feature is an enhanced version of their mobile processor SpeedStep technology called just that, Enhanced SpeedStep Technology; EIST or EST. EIST will allow the operating system to lower the CPU's power state during idleness which will reduce heat dissipation and power consumption. Another feature which will have a great effect on a system's thermal conditions as well as safety is the Thermal Management feature. This feature allows the CPU to immediately cut its clock speed to a fraction of its normal operating clock speed when the motherboard detects it is operating at temperatures out of the norm. There are a lot of Centrino-eque technologies at work here. The lessons learned from Pentium M have played heavily on system design as well as processor design.
So how will Intel's new BTX form factor affect third party manufacturers specializing in cooling equipment? The fact of the matter is that cooling hardware will always be required. We have seen in past ATX case reviews that no matter how many fans are in a case, a single 80mm fan at the front as an intake, or a set of six 80mm fans throughout a mid tower case, current hardware will operate under normal loads. Users, however, still prefer to spend their money on extra cooling equipment to get the most out of their systems. Intel has been bundling their heatsink fans with their CPU's since the beginning while third party manufacturers like Zalman and Thermaltake provide solutions for enthusiasts who prefer custom hardware. So the market for third part hardware will still be there for the BTX form factor as it has been for ATX.
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DerekBaker - Monday, November 15, 2004 - link
#25From here I should think: ">From the picture we see the flow of warm air pulled forward from beyond the VGA card. As it moves towards the front of the case the air flows over the Southbridge and Northbridge passively cooling each chip. We then see from the shades of red the air warms up as it flows through the CPU heatsink then begins to cool as it moves out the front of the case."
http://www.anandtech.com/casecooling/showdoc.aspx?...
Derek
Oxonium - Monday, November 15, 2004 - link
Let's see, a new form factor with new case requirements and STILL no standardized connector for the front Power/Reset/LED's/etc.? I'm all for cooler cases, but a standardized connector for those items is something that should have been implemented years ago.HardwareD00d - Monday, November 15, 2004 - link
#24, who cares since athlons run much cooler and don't need this case form factor.Doormat - Monday, November 15, 2004 - link
I heard a rumor that it wont work with Athlon 64 chips or any type of chip that has the memory controller integrated with the processor, because the distance between the processor and the RAM banks are too far. Anyone confirm this?Superbike - Monday, November 15, 2004 - link
Wow AT is back.phisrow - Monday, November 15, 2004 - link
While I agree that the tweaky enthusiast market doesn't have much to gain at the moment by moving from ATX to BTX, especially as most of them are running A64s or praying-for-death overclocked mobile Athlons, I think there is certainly something to be said for the form-factor. It does seem to be more efficient for cooling than your average ATX(especially for small cases). Even if you are running some PentiumM or a derivative thereof, more efficient is still better. After all, if a given case design can cool a high-end Prescott without deafening its user, it can probably cool a brutally overclocked Pentium M with its fans running at half the speed. For that matter, if the trace length issues aren't actually crippling, I would like to see some A64 motherboards in this format.johnsonx - Monday, November 15, 2004 - link
Visualize an office full of MicroBTX Desktop computers. Visualize the women in the office cupping their hands around the heat exhaust... visualize the overclocking tips flowing around the female staff as they strive to increase heat output... visualize the men pouring sweat, desparately trying to duct-tape the front vent to block the hot Intel Air.I'm sorry, but any spec that seeks to exhaust hot air out the FRONT of any case, whether it be a desktop, tower or SFF, is just plain STUPID.
araczynski - Monday, November 15, 2004 - link
my god, after all these years, they fall back on the packard bell mentality...KristopherKubicki - Monday, November 15, 2004 - link
GTMan: Temperatures were certainly taken with the cases closed.Kristopher
GTMan - Monday, November 15, 2004 - link
I wonder if all those temperature measurements were done with the case open? I would think a case designed for efficient air flow would only perform properly (as designed) when fully assembled!!!