Intel's Long Awaited BTX Form Factor

BTX Cooling and Airflow

Again, the main reasoning behind Intel during the redesign of the ATX form factor was to design a more efficient cooling solution. As components are built faster they also run hotter. The ATX form factor improved on the AT specifications by placing the CPU closer to the back of the case where fans could be mounted as exhausts to pull hot air from the CPU out of the chassis and away from other components. Now that those other components in PCs are beginning to expand in performance and functionality they are running at temperatures as high as that of CPUs so a new design needed to be devised to help cool these components in a more efficient manner than just slapping more fans in a standard case.  Now, we have come full circle with the CPU moving back towards the front of the case.  Since Intel has the standards on PCIe very heavily controlled, worrying about PCIe cards extending too far to the front of the case should not be a problem. 

Intel implements a more efficient passive cooling system by placing the majority of components inline with the CPU towards the rear of the chasis.

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The most important piece of hardware when it comes to cooling is the CPU heat sink fan. Without this a CPU would not POST, and would most likely damage the hardware. Intel has included what it calls a "BTX Thermal Module" which consist of either a spiral or stacked-fin heatsink and a fan which is mounted at the end of a plastic duct, facing the front end of the case. Intel has not limited this hardware to only one type though. In their virtual press kit Intel speaks of Type I (Standard height) and Type II (Low profile) thermal modules. The Type I module will be designed for a broader range of cases from small form factor to the larger full tower applications while the Type II module will be designed specifically for the ultra-small form factor designs.

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Intel also mentioned that along with those two types of thermal modules there will be variations in the units for processors rated at different Thermal Design Power, or TDP levels. The difference in modules will exist mainly with the heatsink, with slight variations in the duct. The fan will, however, remain the same within the same type (Type I/Type II) of module.

This thermal module was the only piece of cooling hardware aside from the power supply which we found to be surprising. We couldn't imagine running an ATX case with only one CPU heatsink fan and we have our doubts about Intel's single module design, but we will leave that to our benchmarks to decide.