Scythe Andy Samurai Master vs. Thermaltake MaxOrb
by Wesley Fink on June 4, 2007 5:00 AM EST- Posted in
- Cases/Cooling/PSUs
CPU Cooling Test Configuration
The standard test bed for cooling tests uses an EVGA NVIDIA 680i SLI motherboard. This is primarily based on the consistent test results on this board and the excellent NVIDIA Monitor temperature measurement utility, which is part of the nTune program.
NVIDIA Monitor has a drop-down pane for temperature measurement which reports CPU, System, and GPU results. Reviews at this point will concentrate primarily on CPU temperature. In addition to the real-time temperature measurement, NVIDIA Monitor also has a logging feature which can record temperature to a file in standard increments (we selected every 4 seconds). This allows recording of temperatures during testing and play back, for example, of stress test results that can then be examined when the stress tests are completed. There is also the handy reference of speeds and voltages in the top pane to confirm the test setup.
NVIDIA Monitor was compared to test results from the Intel TAT (Thermal Analysis Tool). Intel TAT CPU portions do function properly on the EVGA 680i motherboard, but the chipset-specific features do not operate as they should. Idle temperatures in TAT were in line with measured idle temps with NVIDIA Monitor. The CPU stress testing with TAT pushing both cores showed TAT stress temps at 80% CPU usage roughly corresponded to temps reported in our real-world gaming benchmark.
Other components in the cooling test bed are generally the same as those used in our motherboard and memory test bed:
All cooling tests are run with the components mounted in a standard mid-tower case. The idle and stress temperature tests are run with the case closed and standing as it would in most home setups. We do not use auxiliary fans in the test cooling case, except for the Northbridge fan attached to the 680i for overclocking.
Scythe and Thermaltake provided a generic white cooling compound, so we skipped this and tested with our standard premium silver-colored thermal compound. In our experience the thermal compound used makes little to no difference in cooling test results. This is particularly true now that processors ship with a large manufacturer-installed heatspreader. Our only control on thermal compound is that we use the manufacturer-supplied product if they supply a premium product or a standard high-quality thermal paste if a premium brand is not supplied.
We first tested the stock Intel cooler at standard X6800 speed, measuring the CPU temperature at idle and while the CPU was being stressed. We stressed the CPU by running continuous loops of the Far Cry River demo. The same tests were repeated at the highest stable overclock we could achieve with the stock cooler. Stable in this case meant the ability to handle our Far Cry looping for at least 30 minutes.
The same benchmarks were then run on the cooler under test at stock, highest stock cooler OC speed (3.73GHz), and the highest OC that could be achieved in the same setup with the cooler being tested. This allows measurement of the cooling efficiency of the test unit compared to stock and the improvement in overclocking capabilities, if any, from using the test cooler.
Noise Levels
In addition to cooling efficiency and overclocking abilities, users shopping for CPU cooling solutions may also be interested in the noise levels of the cooling devices they are considering. Noise levels are measured with the case open on its side and are measured using a C.E.M. DT-8850 Sound Level meter. This meter allows accurate sound level measurements from 35b dB to 130 dB with a resolution of 0.1 dB and an accuracy of 1.5 dB. This is sufficient for our needs in these tests, as measurement starts at the level of a relatively quiet room. Our own test room, with all computers and fans turned off, has a noise level of 36.4 dB.
Our procedures for measuring cooling system noise are described on the page reporting measured noise results comparing the stock Intel cooler and recently tested CPU coolers to the Thermaltake MaxOrb and Scythe Andy Samurai Master coolers.
The standard test bed for cooling tests uses an EVGA NVIDIA 680i SLI motherboard. This is primarily based on the consistent test results on this board and the excellent NVIDIA Monitor temperature measurement utility, which is part of the nTune program.
NVIDIA Monitor has a drop-down pane for temperature measurement which reports CPU, System, and GPU results. Reviews at this point will concentrate primarily on CPU temperature. In addition to the real-time temperature measurement, NVIDIA Monitor also has a logging feature which can record temperature to a file in standard increments (we selected every 4 seconds). This allows recording of temperatures during testing and play back, for example, of stress test results that can then be examined when the stress tests are completed. There is also the handy reference of speeds and voltages in the top pane to confirm the test setup.
NVIDIA Monitor was compared to test results from the Intel TAT (Thermal Analysis Tool). Intel TAT CPU portions do function properly on the EVGA 680i motherboard, but the chipset-specific features do not operate as they should. Idle temperatures in TAT were in line with measured idle temps with NVIDIA Monitor. The CPU stress testing with TAT pushing both cores showed TAT stress temps at 80% CPU usage roughly corresponded to temps reported in our real-world gaming benchmark.
Other components in the cooling test bed are generally the same as those used in our motherboard and memory test bed:
Cooling Performance Test Configuration | |
Processor | Intel Core 2 Duo X6800 (x2, 2.93GHz, 4MB Unified Cache) |
RAM | 2x1GB Corsair Dominator PC2-8888 (DDR2-1111) |
Hard Drive(s) | Hitachi 250GB SATA2 enabled (16MB Buffer) |
Video Card | 1 x EVGA 7900GTX - All Standard Tests |
Platform Drivers | NVIDIA 9.53 |
NVIDIA nTune | 5.05.22.00 (1/16/2007) |
Video Drivers | NVIDIA 93.71 |
CPU Cooling | Thermaltake MaxOrb Scythe Andy Samurai Master Cooler Master GeminII Noctua NH-U12F ASUS Silent Square Pro Scythe Ninja Plus Rev. B OCZ Vindicator Thermalright Ultra 120 Extreme Thermalright Ultra 120 Scythe Infinity Zalman CNS9700 Zalman CNS9500 Cooler Master Hyper 6+ Vigor Monsoon II Lite Thermalright MST-9775 Scythe Katana Tuniq Tower 120 Intel Stock HSF for X6800 |
Power Supply | OCZ PowerStream 520W |
Motherboards | EVGA nForce 680i SLI (NVIDIA 680i) |
Operating System | Windows XP Professional SP2 |
BIOS | Award P26 (1/12/2007) |
All cooling tests are run with the components mounted in a standard mid-tower case. The idle and stress temperature tests are run with the case closed and standing as it would in most home setups. We do not use auxiliary fans in the test cooling case, except for the Northbridge fan attached to the 680i for overclocking.
Scythe and Thermaltake provided a generic white cooling compound, so we skipped this and tested with our standard premium silver-colored thermal compound. In our experience the thermal compound used makes little to no difference in cooling test results. This is particularly true now that processors ship with a large manufacturer-installed heatspreader. Our only control on thermal compound is that we use the manufacturer-supplied product if they supply a premium product or a standard high-quality thermal paste if a premium brand is not supplied.
We first tested the stock Intel cooler at standard X6800 speed, measuring the CPU temperature at idle and while the CPU was being stressed. We stressed the CPU by running continuous loops of the Far Cry River demo. The same tests were repeated at the highest stable overclock we could achieve with the stock cooler. Stable in this case meant the ability to handle our Far Cry looping for at least 30 minutes.
The same benchmarks were then run on the cooler under test at stock, highest stock cooler OC speed (3.73GHz), and the highest OC that could be achieved in the same setup with the cooler being tested. This allows measurement of the cooling efficiency of the test unit compared to stock and the improvement in overclocking capabilities, if any, from using the test cooler.
Noise Levels
In addition to cooling efficiency and overclocking abilities, users shopping for CPU cooling solutions may also be interested in the noise levels of the cooling devices they are considering. Noise levels are measured with the case open on its side and are measured using a C.E.M. DT-8850 Sound Level meter. This meter allows accurate sound level measurements from 35b dB to 130 dB with a resolution of 0.1 dB and an accuracy of 1.5 dB. This is sufficient for our needs in these tests, as measurement starts at the level of a relatively quiet room. Our own test room, with all computers and fans turned off, has a noise level of 36.4 dB.
Our procedures for measuring cooling system noise are described on the page reporting measured noise results comparing the stock Intel cooler and recently tested CPU coolers to the Thermaltake MaxOrb and Scythe Andy Samurai Master coolers.
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Tuvoc - Monday, June 4, 2007 - link
I'd love to see you guys test this. It is incredibly cheap, yet many claim it to have class-leading performance. Only a proper Anandtech test can reveal the truth... :-)Imnotrichey - Monday, June 4, 2007 - link
I was thinking the same thing. So many sites swear by the Freezer 7 Pro.yacoub - Monday, June 4, 2007 - link
Why does it look like the heatsink is off-center from the base?http://images.anandtech.com/reviews/cooling/2007/s...">http://images.anandtech.com/reviews/coo...ndy-ther...
Is that poor quality manufacturing or by design? I'd be worried about it not evenly drawing the heat away from the CPU core, leaving a hot spot where the heatsink isn't directly over the contact area.
Also curious: Will you guys ever include the numbers for the Arctic Cooling Freezer 7 Pro? It's sort of a mainstay HSF for socket 775 boards and I'm curious how it compares to the hsfs you have tested. It would be nice to know if it'd be worth ~$50-60 to upgrade from my Freezer 7 Pro or if it is already relatively effective compared to the rest of the field.
oldhoss - Monday, June 4, 2007 - link
This one's kinda recent:
http://www.pureoverclock.com/article642-2.html">http://www.pureoverclock.com/article642-2.html
insurgent - Monday, June 4, 2007 - link
How come nobody reviews the Thermalright SI-128 (sites that matter anyways)? I'd like to know how it compares to the other "high-end" heatsinks.Ver Greeneyes - Monday, June 4, 2007 - link
I have a Thermalright XP-90C installed in my PC, and recently I got the novel idea of turning the cooler upside down so that it's pulling air away from my mobo.. and got a significantly lower temperature. Logically, I don't think down-blowing fans mounted on top of a heatsink make sense - the heat from CPU and surrounding components goes into the heatsink, and then you blow it back down at your mobo? I've also found this setup to be very dusty. My XP-90C might just be an anomaly, but I do wonder how other setups will fare with a fan that faces away from the motherboard.PS: another small advantage is that you can't get at the fan-blades on accident with this setup, although they had better not be pressed against the heatsink itself!
xsilver - Monday, June 4, 2007 - link
p1"However, the MaxOrb is still large enough to mount an integral 110mm fan. As yo"
should be internal?
sjholmesbrown - Monday, June 4, 2007 - link
No, integral is the word. Internal would imply the fan was completely enclosed by the cooler (a'la Tuniq tower), integral means the fan is integrated (catch the link) into the cooler, not a separate component.xsilver - Monday, June 4, 2007 - link
in·te·gral(nt-grl, n-tgrl)
adj.
1. Essential or necessary for completeness; constituent: The kitchen is an integral part of a house.
im no english teacher, but I think im right.
integral means essential - of course a fan is essential to a HSF but the meaning in the sentence was to imply that the fan is internal and cannot be removed.
yacoub - Monday, June 4, 2007 - link
Integral is more correct. It's necessary for proper functioning of the device but it's not internal - that would be something completely inside the heatsink.