Samsung & Verizon Launch the Samsung Galaxy S10 5G in the US
Samsung and Verizon on Thursday officially started sales of the Galaxy S10 5G smartphone in the US. The handset is immediately available exclusively with a Verizon contract whether it...
3 by on 5/16/2019SanDisk's First 1 TB microSD Card Now Available
Marking a new high in microSD card capacities, Western Digital has started shipping its flagship SanDisk Extreme 1 TB microSDXC card. This is the company's (and industry's) first 1...
22 by on 5/16/2019KLEVV Cras X RGB: Up to DDR4-4266, Coming at Computex
KLEVV, a partner business of SK Hynix, has always been rather conservative when it comes to speed bins of its memory modules for gamers and overclockers, partly because the...
8 by on 5/15/2019Corning Unveils Astra Glass for 8K Monitors
Corning has introduced its new glass substrate that was developed specially for mid-to-large-size displays featuring a high pixel density. Corning’s Astra Glass takes into account not only high resolutions...
28 by on 5/15/2019Lenovo Announces ThinkReality A6 AR Headset
Lenovo has unveiled its new family of AR headsets designed primarily for business applications. Lenovo’s ThinkReality head mounted displays will feature software and hardware developed by Lenovo for workers...
3 by on 5/15/2019Samsung Reveals Galaxy S10 5G Launch Dates in the UK
Samsung has announced launch dates for its Galaxy S10 5G smartphone in the UK. The handset will be available for pre-order a week from now and will ship to...
5 by on 5/15/2019Samsung Samples 32 Gb DDR4 Memory Chips
Samsung recently began sampling of its DDR4 memory chips featuring a 32 Gb capacity. The new products will simplify production of high-capacity memory modules that use multiple DRAM packages.
8 by on 5/15/2019Dell’s 75-Inch 4K Display with Multitouch: A Rival for Microsoft Surface Hub
Dell has started sales of its 75-inch 4K monitor supporting multi-touch capabilities, and combined the device with a set of interactive features. The new Dell 75 4K Interactive Touch...
22 by on 5/14/2019Samsung to End B-Die DDR4: The Overclockers' Favorite
For many years leading DRAM module manufacturers have used Samsung’s B-die 8 Gb memory chips for their fastest and most advanced DIMMs. This quarter Samsung intends to discontinue production...
16 by on 5/14/2019Lenovo Unveils ThinkPad X1 Extreme Gen 2: New CPU, GPU, OLED Display Option
Lenovo has introduced its second-generation ThinkPad X1 Extreme laptop for performance demanding professionals. It comes equipped with a faster CPU and GPU when compared to the current generation 15.6-inch...
16 by on 5/14/2019OnePlus Teases the OnePlus 7 Pro 5G: Seven Pro + 5G Later This Year
Alongside their new OnePlus 7 and OnePlus 7 Pro smartphones, OnePlus also used their UK event this afternoon to tease their first 5G-capable smartphone: the OnePlus 7 Pro 5G...
5 by on 5/14/2019The Lenovo ThinkCentre Nano M90N: When Small Is Beautiful
People today want larger displays. Yet here comes a problem: the amount of space on the desk is finite, so there is a need for smaller desktop PCs and...
22 by on 5/13/2019Intel Memory Plans: No New NAND Capacity, Wants to Move 3D XPoint Production to China
Like the rest of NAND flash industry, Intel is not particularly happy with oversupply on the market and decreasing prices. The company already said that it would reduce NAND...
29 by on 5/13/2019SK Hynix Begins Sampling of 96-Layer 1 Tb 3D QLC NAND
SK Hynix recently started sampling of its 1 Tb 96-layer NAND flash memory devices featuring its PUC 3D QLC architecture. The new 1 Tb chip will enable SSD makers...
14 by on 5/10/2019Lenovo's ThinkPad X395: A 13.3-Inch AMD Ryzen Pro-Based Ultraportable
Long one of AMD's closest and most eager laptop partners, Lenovo has introduced one of the industry’s first Ryzen Pro 3000-powered ultra-portable premium business laptops. The ThinkPad X395 features...
55 by on 5/9/2019SMART Modular Announces 32 GB SO-DIMMs for Extreme Environments
SMART Modular has introduced the industry’s first industrial-grade 32 GB DDR4 SO-DIMMs. The memory modules are aimed at ruggedized computing applications that require top-of-the-line capacity modules with improved reliability.
2 by on 5/9/2019Samsung Unveils 64 MP & 48 MP ISOCELL Bright Image Sensors for Smartphones
Samsung has introduced two new 0.8-μm image sensors for use in upcoming smartphones. The new sensors are the 48 MP ISOCELL Bright GM2 for advanced handsets as well as...
17 by on 5/9/2019Intel Xeon Update: Ice Lake and Cooper Lake Sampling, Faster Future Updates
Emerging workloads will require considerably higher performance, and in order to solve upcoming challenges Intel has adjusted its product roadmaps quite significantly. One of the key things that Intel...
29 by on 5/9/2019Intel Details Manufacturing through 2023: 7nm, 7+, 7++, with Next Gen Packaging
At Intel's Investor Day today, CEO Bob Swan and Murthy Renduchintala spoke to the ability of the company with respect to its manufacturing capabilities. Intel has historically been strong...
237 by on 5/8/2019Intel Process Technology Update: 10nm Server Products in 1H 2020, Accelerated 7nm in 2021
Intel provided an update regarding its upcoming fabrication technologies at its 2019 Investor Meeting. The company is on track to produce server-class products using its 10 nm manufacturing technology...
74 by on 5/8/2019