Memory
The CXL consortium has had a regular presence at FMS (which rechristened itself from 'Flash Memory Summit' to the 'Future of Memory and Storage' this year). Back at FMS 2022, the company had announced v3.0 of the CXL specifications. This was followed by CXL 3.1's introduction at Supercomputing 2023. Having started off as a host to device interconnect standard, it had slowly subsumed other competing standards such as OpenCAPI and Gen-Z. As a result, the specifications started to encompass a wide variety of use-cases by building a protocol on top of the the ubiquitous PCIe expansion bus. The CXL consortium comprises of heavyweights such as AMD and Intel, as well as a large number of startup companies attempting to play in different segments on...
Intel to Support 128GB of DDR4 on Core 9th Gen Desktop Processors
One of today’s announcements threw up an interesting footnote worthy of further investigation. With its latest products, HP announced that their mainstream desktop platforms would be shipped with up...
24 by Ian Cutress on 10/15/2018
G.Skill Announces DDR4-4800 and DDR4-4500 Kits for Z390 Boards
Every major CPU platform announcement brings a host of new motherboards and faster memory modules to the market. The launch of Intel’s 9th Gen Core processors and Z390 chipset...
30 by Anton Shilov on 10/12/2018
Intel Veteran Becomes Chairman of Toshiba Memory
Toshiba Memory Corp. (TMC) on Thursday disclosed that Stacy Smith, a former high-ranking exec of Intel, was appointed executive chairman, effective October 1. Mr. Smith brings a wealth of...
3 by Anton Shilov on 10/11/2018
G.Skill Unveils 32 GB Trident Z RGB DC DDR4: Double Height, Double Capacity Memory
G.Skill has announced its new 32 GB “Double Capacity” memory modules. The Trident Z RGB DC DIMMs are compatible only with select Z390 motherboards from ASUS, and while they...
7 by Anton Shilov on 10/11/2018
Colorful Enters DRAM Module Business: Generic Colorfire & Custom iGame DIMMs
Colorful has introduced its first memory modules, officially adding a new product category that will complement its graphics cards, motherboards, and SSDs. The initial lineup consists of generic DIMMs...
4 by Anton Shilov on 10/1/2018
Double Height, Double Capacity DDR4? ZADAK's New 32 GB UDIMMs
ZADAK, a maker of memory modules from Taiwan, has reportedly published photos of its upcoming unbuffered memory modules featuring a 32 GB capacity. The UDIMMs and SO-DIMMs are the...
22 by Anton Shilov on 9/28/2018
Team Group's Quick Memory: T-Force Xtreem DDR4-4300 / DDR4-4500 CL18
Team Group has introduced its new dual-channel DDR4 memory kits for overclockers - the new T-Force Xtreem kits operate at 4300 MT/s and 4500 MT/s data transfer rates. Team Group’s...
13 by Anton Shilov on 9/20/2018
Toshiba Memory and Western Digital Open Fab 6 and New Memory R&D Center
Toshiba Memory and Western Digital on Wednesday officially opened up their new Fab 6 and Memory R&D Center. Both facilities are located at their Yokkaichi operations site that now...
6 by Anton Shilov on 9/20/2018
Samsung Adds 32 GB UDIMMs to Memory Lineup
Samsung has quietly added 32 GB unbuffered DDR4 memory modules to its lineup of products. The UDIMMs are based on the company’s 16 Gb chips, which were introduced earlier...
19 by Anton Shilov on 9/5/2018
Micron to Expand Its Fab 6 in Virginia, Build New R&D Center
Micron this week announced plans to expand production of DRAM and NAND memory at its fab in Manassas, Virginia. In total, Micron intends to invest $3 billion into the...
11 by Anton Shilov on 8/31/2018
Hot Chips 2018: Nanotubes as DRAM from Nantero, a Live Blog
Lots of different types of 'RAM' have been in the news, most noticably Intel's Optane memory and a couple of weeks ago at Flash Memory Summit we had the...
19 by Ian Cutress on 8/21/2018
Inno3D Releases iChill Memory Modules with RGB LEDs, Up to DDR4-4000
Inno3D is primarily known for its graphics cards featuring highly custom cooling systems, but apparently the company has decided to expand its business beyond that. This week Inno3D introduced...
2 by Anton Shilov on 8/14/2018
Flash Memory Summit, Western Digital Keynote Live Blog
Second Keynote for us: Western Digital
0 by Ian Cutress & Billy Tallis on 8/7/2018
MRAM Developer Day, IBM Keynote Live Blog
Third Keynote in this session is from IBM Research: STT-MRAM is Ready for Applications Today.
0 by Ian Cutress on 8/6/2018
MRAM Developer Day, GlobalFoundries Keynote Live Blog
Second Keynote today is from GlobalFoundries, Everspin's MRAM partner.
1 by Ian Cutress on 8/6/2018
MRAM Developer Day, Everspin Keynote: The MRAM Revolution (9:15am PT, 4:15pm UTC)
Prior to Flash Memory Summit, the first order of business is the MRAM Developer Day. The key talks today revolve around Everspin, a leader in MRAM Technology, GlobalFoundries, and...
3 by Ian Cutress & Billy Tallis on 8/6/2018
Yangtze Memory Unveils Xtacking Architecture for 3D NAND: Up to 3 Gbps I/O
Yangtze Memory Technologies Co. (YMTC) on Monday unveiled key details regarding its Xtacking architecture that will be used for its upcoming 3D NAND flash memory chips. The company's technology...
7 by Anton Shilov on 8/6/2018
SK Hynix Set to Build a New Memory Fab
SK Hynix last week announced plans to build another semiconductor fab near its headquarters in Icheon, South Korea. The production facility is not going to be as big and...
16 by Anton Shilov on 7/30/2018-678_carousel.png)
Samsung Starts Production of 16 Gb LPDDR4X Chips Using 2nd Gen 10nm Tech
Samsung this week announced that it has begun manufacturing its new LPDDR4X memory chips using its second-generation 10 nm-class fabrication process (which is traditionally called 1y nm). The new...
12 by Anton Shilov on 7/27/2018
Toshiba Begins to Construct New BiCS 3D NAND Fab in Iwate Prefecture
Toshiba Memory Corp. this week held a groundbreaking ceremony for its new BiCS 3D NAND flash memory fab, which is located in Japan's Iwate prefecture. Toshiba anticipates construction to...
7 by Anton Shilov on 7/25/2018
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